Purpose of flux and features of its use in soldering

The soldering process involves joining different metal parts by filling the space between them with molten metal. This is accompanied by the application of flux to the mating surfaces. Removing the oxide film, better spreading of solder over the surface of the mating parts and better quality of their connection - this is why the auxiliary material flux is needed when soldering.

Purpose of the material

The purpose of fluxes is to prepare parts for soldering, clean surfaces from fats and salts, protect solder from oxidation during the soldering process and facilitate its better spreading over the surface. When soldering, flux extends the service life of connections, as it protects soldering areas from oxidation and destruction. The flux should be characterized by a low melting point and low specific gravity. Then it will have time to dissolve the oxides, but will not penetrate deep into the soldering joint. Good fluxes should not evaporate when heated and cause corrosion. They can be easily removed from parts.

What are soldering fluxes used for?

Nevertheless, the importance of the role of rosin, like any other fluxes (which will be discussed later), is that it prepares the parts for reliable connection with each other, cleaning their surfaces from oxide film, salts and fats that prevent contact of surfaces. The purpose of flux is also to reduce the surface tension in the solder substance, which ensures its better fluidity. Thanks to this, it spreads over the largest possible space, increasing the contact area of ​​the elements being soldered. In addition, fluxes extend their service life by protecting parts at soldering points from the formation of new oxides and salts. True, some of them, without proper neutralization, can cause premature failure of parts. Therefore, you must strictly follow the instructions for using this or that composition.

Classification of fluxes

Fluxes vary in the degree of their effect on the workpieces. When soldering, the following types of auxiliary materials are used:

Active fluxes. These auxiliary substances actively interact with the metals being joined. Depending on the materials being joined and their properties, the following types are used:

  • Containing dilute hydrochloric acid. Used for soldering zinc and galvanized metals. After soldering, the parts must be cleaned to avoid corrosion. Can be washed in warm water.
  • Zinc chloride solution (etched hydrochloric acid). Used for soldering copper, copper alloys and steel.
  • Zinc ammonium chloride. It is obtained by adding ammonium to a solution of zinc chloride. Ammonium increases the activity of the auxiliary material and lowers its melting point.

Acidic compounds are chemically active. After their use, neutralization is required. Another property of these compositions is high electrical conductivity, and therefore they are unsuitable for use in electrical engineering.

Acid-free. They are also called inactive. They interact only with the solder, and not with the parts being joined. These include rosin. This is a resin from coniferous trees that has undergone special treatment. It looks like glassy pieces of yellow color, reminiscent of amber. Contains a low amount of fatty acids and does not corrode contacts unless completely removed after soldering. Used for soldering copper, silver, brass, gold. Inactive fluxes also include substances made from rosin with the addition of alcohol, glycerin, and turpentine.

Anti-corrosion. Used to clean the surfaces of connected parts from corrosion. Subsequently, a protective layer should form on the parts to prevent oxidation. The composition of these compounds necessarily includes orthophosphoric acid.

Protective. This includes substances intended only to protect the connection. This can be petroleum jelly, wax or mineral oils. You can apply liquid flux with a cotton swab or brush. For convenience, you can purchase a “flux applicator”.

Excipients are characterized by differences in consistency. They are:

  • liquid;
  • hard;
  • pasty.

Liquid ones are used in hard-to-reach places. Paste-like ones are most convenient to use. They are easy to apply.

Another distinguishing feature of different types of fluxes is the melting point. Low-temperature ones melt at temperatures less than 450 °C, and high-temperature ones have a melting point above 450 °C.

Requirements for auxiliary materials

There are general requirements that apply to all types of excipients. What basic properties should they have:

  • The fluidity and viscosity of the composition must be in such a ratio that it is possible to wet the entire surface to be treated without spreading beyond the processing boundaries.
  • Fluxes should react only with oxidized films, and not with the parts being connected and solder.
  • Flux should have less adhesion than solder.
  • The substance must not evaporate or burn out.
  • The flux should be easily removed after completion of work.

How to solder with flux: first you need to prepare the parts, then treat them with the material, then heat the parts to the desired temperature and apply solder to the treated area.

Application for various metals

Phosphoric and soldering acids are used for soldering parts made of stainless and alloy steel. Borax is used for soldering cast iron, precious metals, and nickel-cobalt alloys. Borax is often used in the repair of plumbing systems. Soldering fat is used when soldering lead couplings to the lead sheath of a cable. It consists of rosin, animal fat and stearin.

Flux brand FPPU25 is used for tinning and soldering of current-carrying parts made of copper and its alloys. For soldering ferrous metals, the active auxiliary material zinc chloride is used.

If you don’t have ready-made flux on hand, you can use a solution of aspirin tablets in cologne, fruit juice or olive oil instead.

To create a strong solder joint, you need a good soldering iron with a properly selected tip, as well as solder and flux that are suitable for this type of work. Only if these conditions are met can the required connection quality be ensured.

Classification of fluxes and their designation system

Soldering fluxes are substances and compounds used to prevent the formation of an oxide film on the surface of the solder and the soldered material, as well as to remove oxidation products from the soldering zone. The melting point of fluxes is lower than the melting point of solder. Fluxes are used in solid, paste and powder form, as well as in the form of aqueous, alcohol or glycerin solutions.


Fluxes used for soldering are classified according to:

  • temperature range of activity;
  • nature of the solvent;
  • the nature of the activator of the determining action;
  • mechanism of action;
  • state of aggregation.

Depending on the temperature range of activity, soldering fluxes are divided into:

  • low temperature (≤450 °C);
  • high temperature (>450 °C).

Based on the nature of the solvent, soldering fluxes are divided into:

  • aquatic;
  • non-aquatic

According to the nature of the activators of the determining action, low-temperature soldering fluxes are divided into:

  • rosin;
  • halide;
  • hydrazine;
  • fluoroborate;
  • anilic;
  • stearic.

According to the nature of the activators of the determining action, high-temperature soldering fluxes are divided into:

  • halide;
  • fluoroborate;
  • boride-carbon dioxide.

If the flux contains several activators, all activators must be named. For example, rosin-halide, fluoroborate-halide flux.

According to their state of aggregation, soldering fluxes are divided into:

  • hard;
  • liquid;
  • pasty.
Properties of fluxes

The parameters of fluxes for soldering with soft and semi-hard solders are given in table. 1 .

Table 1. Fluxes for soldering with soft and semi-hard solders (electrical standards OAA.614.017-67 and OAA.614.028-68)

BrandPurposeBasic data of fluxesCleaning after soldering
ComponentCompound, %
TOTinning and soldering of current-carrying parts made of copper and its alloysPine rosin100Not required
KSPTinning and soldering of current-carrying parts made of copper and its alloysPine rosin25
Technical ethyl alcohol grade B75
FPPTinning and soldering of current-carrying parts made of copper and its alloysPolyester resin grade PA920-30
Methyl ethyl ketone or ethyl acetate80-70
STUZO-12224-61Tinning and soldering of current-carrying parts made of copper, nickel and their alloys and parts coated with copper, tin, cadmium, silver and zincPine rosin20-35A swab or brush soaked in a solvent, such as alcohol
Diethylamine hydrochloride3-5
Triethanolamine1-2
Technical ethyl alcohol grade BRest
F59АОАА. 614.017-67 Tinning and soldering of aluminum and AMts alloy with each other and with copper and its alloysCadmium borofluoride10Running hot water or alcohol
Zinc borofluoride3
Ammonium borofluoride5
Triethanolamine82
34A OAA. 614.017-67 Soldering of aluminum and its alloys (melting point 420 °C)Cadmium fluoride50±6Hot then cold running water
Lithium chloride32±6
Zinc chloride8±2
Sodium fluoride10±1
LM1Tinning and soldering of iron-nickel alloys and stainless steelsPine rosin20-35A swab or brush soaked in a solvent, such as alcohol
Diethylamine hydrochloride3-5
Triethanolamine1-2
Technical ethyl alcohol grade BRest
F38NTinning and soldering nichrome to each other and to copperDiethylamine hydrochloride25-30Hot water or a brush dipped in alcohol
Ethylene glycolRest
Phosphoric acid29-25

The parameters of fluxes for soldering copper and its alloys are given in table. 2 .

Table 2. Fluxes for soldering - composition and methods for removing flux residues

BrandCompoundRemoving flux residues after soldering
Component%
FKSp (FKEt)Pine rosin10-60Ethyl alcohol or alcohol-gasoline mixture 1:1
Ethyl alcohol or ethyl acetate90-40
FCDTPine rosin10-20
Dimethylalkylbenzyl ammonium chloride (kitamine AB)0,1-3,0
Tributyl phosphate0,01-0,10
Ethyl alcohol or ethyl acetate89,89-76,90
LTI-120Pine rosin20-25
Diethylamine hydrochloride3-5
Triethanolamine1-2
Ethanol76-68
FGSSpHydrazine hydrochloride2-4Hot running water (70±10°C) or alcohol-gasoline mixture 1:1
Ethylene glycol or glycerin25-50
Ethanol73-46
FSkSpSemicarbazide hydrochloride2-4
Ethylene glycol or glycerin25050
Ethanol73-46
FSkPsSemicarbazide hydrochloride3-5
Glycerol70-58
Polyox-100 or Polyox-11527-37
FCSSalicylic acid4,0-4,5Alcohol-gasoline mixture 1:1
Triethanolamine1,0-1,5
Ethanol95-94
FDGLDiethylamine hydrochloride4-6Hot running water (70±10°C)
Glycerol96-94
FCAZinc chloride45,5Hot running water (70±10°C) and neutralizing reagents
Ammonium chloride9
Water45,5
Zinc oxide hydrateBefore precipitation occurs
FDFsDiethylamine hydrochloride20-25Hot running water (70±10°C) or alcohol-gasoline mixture 1:1
Ethylene glycol60-50
Phosphoric acid (specific gravity 1.7)20-25
ZhZ-1-APCylinder oil “52” or “KS-19”79-81Alcohol-gasoline mixture 1:1, trichlorethylene, acetone
Organosilicon liquid PFMS-616-17
Oleic acid4,9-1,8
Antioxidant NG-22460,1-0,2
ZhZ-2-APCylinder oil “52” or “KS-19”58,52-69,75
Organosilicon liquid PFMS-621,65-10,66
Cottonseed oil11,0-10,64
Oleic acid8,79-9,02
Antioxidant NG-22460,04-0,03
284Boric anhydride23-27Hot running water (70±10°C) and cold running water
Potassium fluoride33-37
Potassium borofluoride-hydrogen44-36
209Boric anhydride33-37
Potassium fluoride40-44
Potassium borofluoride-hydrogen27-19
200Boric anhydride70-62Hot running water and neutralizing reagents
Sodium tetraborate (borax)17-21
Calcium fluoride13-17
34APotassium chloride56-44Hot running water and neutralizing reagents
Lithium chloride29-35
Zinc chloride6-10
Sodium fluoride9-11
F370APotassium chloride51-46
Lithium chloride36-39
Sodium chloride4-5
Cadmium chloride9-10
16VKSodium chloride12
Potassium chloride44
Lithium chloride34
Eutectic (aluminum fluoride – 54%, potassium fluoride – 46%)10

Table 3. Soldering fluxes - the effect of flux residues on insulation and their corrosive effect

BrandEffect of flux residues on insulation resistanceCorrosive effect of flux residues
for copperfor silver platingon tin-lead coatingfor nickel coating
FKSp (FKEt), FKDTdo not affectdo not provide
LTI-120, FGSp, FSkSpreduceprovidedo not provide
FSkPsreduceprovidedo not provideprovidedo not provide
FCSreducehave a weakdo not provide
FDGLreduceprovidehave a weakdo not providen/a
FDFsreduceprovidedo not providedo not provideprovide
FCAreduceprovide
ZhZ-1-AP, ZhZ-2-APdo not affectdo not provide

When soldering copper conductors, as well as grounding conductors to the armor and lead sheath of cables, use a solder paste consisting of the following components (in parts by weight): rosin - 10, animal fat - 3, ammonium chloride - 2, zinc chloride - 1, water or ethyl alcohol (rectified) - 1. Solder paste is often used as a flux according to the following recipe: rosin - 2.5%, lard - 5%, zinc chloride - 20%, ammonium chloride - 2%, technical petroleum jelly - 65.5% , distilled water - 5%.

Parameters of fluxes for soldering and welding of aluminum are given in table. 4 .

Table 4. Fluxes for soldering and welding aluminum

BrandCompound, %Melting point, °CApplication
Potassium chlorideSodium chlorideLithium chlorideSodium fluorideCryolite grade K-1Magnesium chloride
YOU50-5530-3510—20630For terminating wires and cables
AF-4A50 *28148About 600Only for connecting cable cores in couplings
HP503020
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